Looking at trace impurities on silicon wafers with synchrotron radiation.
نویسندگان
چکیده
Figure 1. TXRF spectrum of a clean Si wafer surface showing 6.4x10 atoms/cm Fe and 2.6x10 atoms/cm Cu. The Cl is a residue from the HCl solution used to clean the wafer surface and the Ag is a artifact from the particular collimator used in these studies. Other features seen in the spectrum are the Si substrate peak, the scatter peak at 11.2 keV and the escape peak at 9.4 keV. Looking at Trace Impurities on Silicon Wafers Using Synchrotron Radiation
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ورودعنوان ژورنال:
- Analytical chemistry
دوره 74 23 شماره
صفحات -
تاریخ انتشار 2002